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Semiconductor Test Services

 

Acceleration Helium Leak Testing on Components
Atmosphere/Altitude to 80,000 ft. HAST Testing
Barometric Pressure Testing Humidity Test
Bond Pull Immersion
Burn-in Testing to +200 Deg C Industrial Temperature Testing
Capacitance Testing Lead Forming
Centrifuge Marking
Class S Testing for Space Non-Destructive Testing
Clean Room Microelectronic Packaging PIND Particle Impact Noise Detection
Commercial Testing Qualification Testing
Cross Sectioning Recertification
Custom Hardware/Software Reliability Testing
Custom IC & Transistor Packaging Power Burn-In
Destructive Testing RF & Microwave Test Services
Die Qualification Radiography
Die Shear Strength Test up to 5.0 Kg Resistance to Solvents
Destructive Physical Analysis - DPA on Components SEM Analysis - Scanning Electron Microscope
Dust Testing Salt Spray
EDAX Serialize Components
Electrical Characteristics Shock Testing
Electrical Testing:
  • High Voltage
  • High Current
Solderability Testing
Element Evaluation Space Level Testing
Environmental Stress Screening Temperature Cycling (-200C to +200C)
Environmental Testing Thermal Shock Testing (+200C)
Equivalent screening for JAN thru JANS Upscreening
Failure Analysis Vibration Testing - Up to 500 lb.
Fine & Gross Leak Testing Wafer Probing
Fungus Test  X-Ray
 

 

MIL-STD-883 TESTS

TEST

METHOD

Bond Strength

2011

Burn-in

2025

Constant Acceleration/Centrifuge

2001

Die Shear

2019

Die Penetrant

1034

External Visual

2009

Internal Visual, Hybrid

2017

Internal Visual inspection for DPA

2013

Internal Visual Mechanical

2014

Internal Visual Monolithic

2010

Lead integrity

2004

Lead Pull for PG

2028

Lid Torque

2024

Mechanical Shock

2002

Moisture Resistance

1004

Non-destructive Bond Pull

2023

Physical Dimensions

2016

PIND-Particle Impact Noise Detection

2020

Qualification and Quantity Conformance Inspection

5005

Resistance to Solvents

2015

Salt Atmosphere

1009

Screening

5004

Seal - Leak Test

1014

Solderability

2003

Stabilization Bake

1008

Steady State Life

1005

Temperature Cycling

1010

Thermal Shock

1011

Vibration Variable Frequency

2007

Electronic Components Tested

  • DC to DC  Converters
  • Digital ICs
  • Diodes
  • Capacitors
  • Custom ASICs
  • FETs
  • Fuses
  • Integrated Circuits
  • Linear ICs

  • LED Testing
  • Memory Chips
  • Microprocessors
  • Optics
  • Rectifier Bridges
  • Relays
  • Resistors
  • Switches
  • SCR's
  • Transistors
  • Triacs

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Tandex Test Labs Logo

TEST LABS, INC.

15849 Business Ctr Dr.

Irwindale, Ca. 91706-2053 U.S.A.

TOLL FREE 800.729.8378

Phone: 626.962.7166 Fax: 626.960.6896


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