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Electronic Component Assembly


Tandex is pleased to announce the addition of the ESEC Wire Bonder To our family

In our clean room, the ESEC 3018 has taken precedence in allowing Tandex to manufacture custom microelectronics with our new Automated Gold Ball Bonder.  Contact Tandex for any of your special needs to have parts built per your spec.

ESEC Automated Gold Ball Bonder



Integrated Circuit Packaging

Custom Microelectronic Packaging


Tandex Custom Hybrid Microcircuit Packaging


Hybrid Microelectronics:


Tandex Materials Management


Procurement, Inspection, Test, Analyze and Certify to Specifications on Schedule. Turn Key Operations for Space Flight Hardware.


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15849 Business Ctr Dr.

Irwindale, Ca. 91706-2053 U.S.A.

TOLL FREE 800.729.8378

Phone: 626.962.7166

 Fax: 626.960.6896

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 Integrated Circuit Packaging Die Attach Wire Bond Integrated Circuit Packaging   Die Attach  Wire Bond   hip Level Packaging Vacuum Bake Integrated Circuit Packaging   Tape and Reel     Die Attach Chip Level Packaging Electronics Reliability testing Integrated Circuit Packaging Internal Visual Inspection Semiconductor Manufacturing Die Attach   Semiconductor Manufacturing and Chip Level Packaging and Die Attach we also do Vacuum Bake Internal Visual Inspection,   Bond pull   Electronics Reliability testing Semiconductor Manufacturing, Wire Bonding and Semiconductor Manufacturing Vacuum Bake Wire Bond Vacuum Bake, tape and reeling services. chip level packaging semiconductor manufacturing Electronics Reliability Internal Visual Inspection Vacuum Bake Chip Level Packaging  Bond pull   Die Attach Wire Bond Internal Visual Inspection Electronics Reliability testing Vacuum Bake Semiconductor Manufacturing and Wire Bonding at Tandex Labs.