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• Destructive Physical Analysis (DPA) Is the process of disassembling, testing, and inspecting a component for the purpose of determining conformance with applicable design and process requirements. This process of sample testing is used to ensure that a high reliability component or device is fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for troublesome production lot problems.
  
  DPA lab Processes include:
  • Bond Pull
  • Delidding
  • Internal Photos
  • External Photos
  • Scanning Electron Microscope (SEM)
  • Energy Dispersive X-ray Analysis (EDXA)

     

• Failure Analysis Capabilities of Tandex Test Labs are extremely important to support our in-house manufacturing efforts and are also available to analyze customer component and equipment problems. Techniques and equipment utilized in providing our Destructive Physical Analysis capability are also used effectively to analyze failures, determine failure causes, and recommend corrective actions. These failure analysis capabilities are exceptionally important in finding early solutions to troublesome production problems that show up as device or component failures.

  
  

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